这台机器采用干涉原理,只要能反射就能测.

具体资料如下,有用得着的请与我联系:

Fringe sensitivity range: continuously variable from 0.5 to 10 micrometers/fringe System accuracy: 0.25 micrometers Maximum test area: 5.0" x 4.5" (major x minor axes) Maximum resolution: 0.10 micrometers Work holder: tilt adjustable in 2 dimensions; accomodates 4 x 4", 5 x 5" photoplates as well as 2", 3", 100mm, and 200mm wafers and slices. Viewing screen: RCA b&w CCTV monitor with 9" CRT Light source: HeNe laser Power input: 67 watts

[此贴子已经被作者于2004-11-18 15:49:10编辑过]

价钱多少？

还有，最小只能测到0.5微米吗？

双面抛光能检测吗？

请问可以测其他晶体么

测硅片时是单面测量么？

如何夹持，是真空么?

是自动的还是手动的?

能测绘出测量区域的形貌图么？

我对这类设备倍感兴趣，所里面正在选购，不知道怎么和你联系啊?

我：zhigang11@sina.com。方便联系我啊

single side measurement for flatness, vacuum to hold the wafer, it can display the wafer contour

还有，最小只能测到0.5微米吗？ max resolution: .1um

双面抛光能检测吗？yes 是自动的还是手动的? manual

直拉的硅片也能测

[此贴子已经被作者于2004-11-18 9:01:26编辑过]